ATMEGA325V-8AUR Microchip Technology IC MCU 8BIT 32KB FLASH 64TQFP

label:
2026/09/22 83
ATMEGA325V-8AUR Microchip Technology IC MCU 8BIT 32KB FLASH 64TQFP


CATALOG
ATMEGA325V-8AUR COUNTRY OF ORIGIN
ATMEGA325V-8AUR PARAMETRIC INFO
ATMEGA325V-8AUR PACKAGE INFO
ATMEGA325V-8AUR MANUFACTURING INFO
ATMEGA325V-8AUR PACKAGING INFO
ATMEGA325V-8AUR ECAD MODELS


COUNTRY OF ORIGIN
Thailand


PARAMETRIC INFO
Family Name ATmega
Data Bus Width (bit) 8
Device Core AVR
Instruction Set Architecture RISC
Maximum Clock Frequency (MHz) 8
Program Memory Type Flash
Program Memory Size 32KB
RAM Size 2KB
Maximum CPU Frequency (MHz) 8
GPIO 54
Number of Timers 3
ADC Channels 8
ADC Resolution (bit) 10
Core Architecture AVR
Number of ADCs 1
PWM 4
Number of Watchdog Timers 1
Analog Comparators 1
Interface Type SPI/USART/USI
Programmability Yes
SPI 2
I2C 0
I2S 0
UART 0
USART 1
CAN 0
USB 0
Ethernet 0
Operating Systems Windows
Minimum Operating Supply Voltage (V) 1.8
Typical Operating Supply Voltage (V) 2.5|3.3|5
Maximum Operating Supply Voltage (V) 5.5
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Temperature Flag Opr
Supplier Temperature Grade Industrial
Operating Supply Voltage (V) 2.5|3.3|5
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65
 

PACKAGE INFO
Supplier Package TQFP
Basic Package Type Lead-Frame SMT
Pin Count 64
Lead Shape Gull-wing
PCB 64
Tab N/R
Pin Pitch (mm) 0.8
Package Length (mm) 14.1(Max)
Package Width (mm) 14.1(Max)
Package Height (mm) 1.05(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 16.25(Max)
Package Overall Width (mm) 16.25(Max)
Package Overall Height (mm) 1.2(Max)
Seated Plane Height (mm) 1.2(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Thin Quad Flat Package
Package Family Name QFP
Jedec MS-026AEB
Package Outline Link to Datasheet
 

MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 20 to 40
Number of Reflow Cycle 3
Standard J-STD-020C
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu Alloy
 

PACKAGING INFO
Packaging Suffix R
Packaging Tape and Reel
Quantity Of Packaging 1000
 

ECAD MODELS



Produkt RFQ