HCF4040BEY STMicroelectronics IC COUNT/DIVIDER 12STAGE 16-DIP

label:
2024/11/28 49
HCF4040BEY STMicroelectronics 	IC COUNT/DIVIDER 12STAGE 16-DIP


• MEDIUM SPEED OPERATION : tPD = 80ns (TYP.) at VDD = 10V
• FULLY STATIC OPERATION
• COMMON RESET
• BUFFERED INPUTS AND OUTPUTS
• STANDARDIZED SYMMETRICAL OUTPUT CHARACTERISTICS
• QUIESCENT CURRENT SPECIFIED UP TO 20V
• INPUT LEAKAGE CURRENT II = 100nA (MAX) AT VDD = 18V TA = 25°C
• 100% TESTED FOR QUIESCENT CURRENT
• MEETS ALL REQUIREMENTS OF JEDEC JESD13B ” STANDARD SPECIFICATIONS FOR DESCRIPTION OF B SERIES CMOS DEVICES”


CATALOG
HCF4040BEY COUNTRY OF ORIGIN
HCF4040BEY PARAMETRIC INFO
HCF4040BEY PACKAGE INFO
HCF4040BEY MANUFACTURING INFO
HCF4040BEY PACKAGING INFO
HCF4040BEY ECAD MODELS


COUNTRY OF ORIGIN
China


PARAMETRIC INFO
Logic Function Counter/Divider
Logic Family 4000B
Process Technology CMOS
Number of Count Input Enables 0
Number of Element Inputs 1
Number of Element Outputs 12
Number of Elements per Chip 1
Number of Selection Inputs per Element 0
Number of Stages 12
Operation Mode UP Counter
Direction Type Uni-Directional
Terminal Count Output No
Triggering Type Negative-Edge
Type Binary
Minimum Operating Supply Voltage (V) 3
Maximum Operating Supply Voltage (V) 20
Typical Operating Supply Voltage (V) 3.3|5|9|12|15|18
Minimum Operating Temperature (°C) -55
Maximum Operating Temperature (°C) 125
Maximum Propagation Delay Time @ Maximum CL (ns) 360@5V|160@10V|130@15V
Absolute Propagation Delay Time (ns) 360
Propagation Delay Test Condition (pF) 50
Maximum Quiescent Current (mA) 0.1
Parallel Enable Input No


PACKAGE INFO
Supplier Package PDIP
Basic Package Type Through Hole
Pin Count 16
Lead Shape Through Hole
PCB 16
Tab N/R
Pin Pitch (mm) 2.54
Package Length (mm) 20(Max)
Package Width (mm) 7.1(Max)
Package Height (mm) 5.1(Max) - 0.51(Min)
Package Diameter (mm) N/R
Seated Plane Height (mm) N/A
Mounting Through Hole
Package Material Plastic
Package Description Plastic Dual In Line Package
Package Family Name DIP
Jedec N/A
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL N/R
Maximum Reflow Temperature (°C) N/R
Reflow Solder Time (Sec) N/R
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) 260
Wave Solder Time (Sec) 10
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Terminal Base Material Cu Alloy
Shelf Life Period 2 Years
Number of Wave Cycles 2


PACKAGING INFO
Packaging Tube
Quantity Of Packaging 25
Packaging Document Link to Datasheet

 
ECAD MODELS  
Produkt RFQ