LTC6082IDHC#PBF Analog Devices IC OPAMP GP 3.5MHZ RRO 16DFN

label:
2026/09/24 78
LTC6082IDHC#PBF Analog Devices IC OPAMP GP 3.5MHZ RRO 16DFN


• Maximum Offset Voltage: 70µV (25°C)
• Maximum Offset Drift: 0.8µV/°C
• Maximum Input Bias: 1pA (25°C) 40pA (TA ≤ 85°C)
• Open Loop Voltage Gain: 120dB Typ


CATALOG
LTC6082IDHC#PBF COUNTRY OF ORIGIN
LTC6082IDHC#PBF PARAMETRIC INFO
LTC6082IDHC#PBF PACKAGE INFO
LTC6082IDHC#PBF MANUFACTURING INFO
LTC6082IDHC#PBF PACKAGING INFO
LTC6082IDHC#PBF ECAD MODELS
LTC6082IDHC#PBF APPLICATIONS


COUNTRY OF ORIGIN
Malaysia


PARAMETRIC INFO
Manufacturer Type Precision Amplifier
Type Precision Amplifier
Rail to Rail Rail to Rail Input/Output
Minimum Single Supply Voltage (V) 2.7
Number of Channels per Chip 4
Minimum PSRR (dB) 98
Typical Single Supply Voltage (V) 3|5
Maximum Single Supply Voltage (V) 5.5
Output Type CMOS
Maximum Quiescent Current (mA) 1.7@5V
Typical Gain Bandwidth Product (MHz) 3.5
Maximum Input Offset Voltage (mV) 0.07@5V
Maximum Input Offset Current (uA) 0.0000001(Typ)@5V
Maximum Input Bias Current (uA) 0.00004@5V@-40C to 85C
Maximum Operating Supply Voltage (V) 5.5
Minimum CMRR (dB) 100
Maximum Supply Voltage Range (V) 5.5 to 6
Minimum CMRR Range (dB) 95 to 105
Typical Voltage Gain (dB) 120
Typical Slew Rate (V/us) 1@5V
Typical Settling Time (ns) 6000
Typical Input Noise Voltage Density (nV/rtHz) 13@5V
Typical Non-Inverting Input Current Noise Density (pA/rtHz) 0.0005@5V
Typical Input Bias Current (uA) 0.0000002@5V
Shutdown Support No
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 125
Power Supply Type Single
 

PACKAGE INFO
Supplier Package DFN EP
Basic Package Type Non-Lead-Frame SMT
Pin Count 16
Lead Shape No Lead
PCB 16
Tab N/R
Pin Pitch (mm) 0.5
Package Length (mm) 5
Package Width (mm) 3
Package Height (mm) 0.75(Max)
Package Diameter (mm) N/R
Seated Plane Height (mm) 0.75
Mounting Surface Mount
Package Material Plastic
Package Description Dual Flat Package No Lead, Exposed Pad
Package Family Name DFN
Jedec MO-229WJED-1
Package Outline Link to Datasheet
 

MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material Ag
Terminal Base Material Cu Alloy
Shelf Life Period 12 Month
Shelf Life Condition 40°C+90 % RH
 

PACKAGING INFO
Packaging Tube
Quantity Of Packaging 73
 

ECAD MODELS



APPLICATIONS
• Photodiode Amplifier
• Strain Gauge
• High Impedance Sensor Amplifier

Produkt RFQ