|
|
• Broad Vcc Operating Range: 1.65 V to 5.5 V
|
• Rail-to-Rail Signal Handling |
• Power Down High-Impedance Inputs/Outputs |
• 5Ω Switch Connection between Two Ports |
• Minimal Propagation Delay through the Switch |
• Low lcc |
• Zero Bounce in Flow-Through Mode |
• Control Input Compatible with CMOS Input Levels |
• Ultra-Small MicroPak TM Packages |
• Space-Saving SOT23 and SC70 Packages |
|
CATALOG |
NC7SZ66P5X COUNTRY OF ORIGIN |
NC7SZ66P5X LIFECYCLE |
NC7SZ66P5X PARAMETRIC INFO |
NC7SZ66P5X PACKAGE INFO |
NC7SZ66P5X MANUFACTURING INFO |
NC7SZ66P5X PACKAGING INFO |
NC7SZ66P5X ECAD MODELS |
|
COUNTRY OF ORIGIN |
China |
Malaysia |
Philippines |
Thailand |
|
LIFECYCLE |
Obsolete
Apr 01,2022 |
|
PARAMETRIC INFO |
Type |
Analog Switch |
Number of Channels per Chip |
1 |
Switch Architecture |
SPST |
Polarity |
Non-Inverting |
Maximum On Resistance Range (Ohm) |
60 to 80 |
Configuration |
Single SPST |
Number of Inputs per Chip |
1 |
Function |
General |
Number of Outputs per Chip |
1 |
Logic Family |
SZ |
Chip Enable Signals |
Yes |
Maximum On Resistance (Ohm) |
60@1.8V |
Maximum Propagation Delay Bus to Bus (ns) |
4.3@1.95V|1.2@2.7V|0.8@3.6V|0.3@5.5V@-40C to 85C |
Maximum Turn-On Time (ns) |
7(Typ)@1.95V |
Maximum Turn-Off Time (ns) |
9.2(Typ)@1.95V |
Maximum Power Dissipation (mW) |
150 |
Input Signal Type |
Single |
Output Signal Type |
Single |
Propagation Delay Test Condition (pF) |
50 |
Maximum High Level Output Current (mA) |
128 |
Switch Control Logic |
Active High |
Switch Normal Position |
NO |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
85 |
Power Supply Type |
Single |
Minimum Single Supply Voltage (V) |
1.65 |
Typical Single Supply Voltage (V) |
3|5 |
Maximum Single Supply Voltage (V) |
5.5 |
|
|
PACKAGE INFO |
Supplier Package |
SC-70 |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
5 |
Lead Shape |
Gull-wing |
PCB |
5 |
Tab |
N/R |
Pin Pitch (mm) |
0.65 |
Package Length (mm) |
2 |
Package Width (mm) |
1.25 |
Package Height (mm) |
1(Max) |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
2 |
Package Overall Width (mm) |
2.1 |
Package Overall Height (mm) |
1.1(Max) |
Seated Plane Height (mm) |
1.1(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Small Outline Transistor |
Package Family Name |
SOT |
Jedec |
MO-203AA |
Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO |
MSL |
1 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
IPC-1752 |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Matte Sn annealed |
Under Plating Material |
N/A |
Terminal Base Material |
CuFeZnP |
|
|
PACKAGING INFO |
Packaging Suffix |
X |
Packaging |
Tape and Reel |
Quantity Of Packaging |
3000 |
Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS |
|
|