PCF8551ATT/AJ NXP Semiconductors IC LCD DRIVER UNIV 48TSSOP

label:

2024/03/11 74

• Single chip LCD controller and driver with temperature range of -40 °C to 85 °C

• Selectable backplane drive configuration: static, 2, 3, or 4 backplane multiplexing

• Selectable display bias configuration: static, 1⁄2, or 1⁄3

• Internal LCD bias generation with buffers

• 36 segment drives:
– Up to 18 7-segment numeric characters
– Up to 9 14-segment alphanumeric characters
– Any graphics of up to 144 segments/elements

• Auto-incrementing display data and instruction loading

• Versatile blinking modes

• Independent supplies of VLCD and VDD

• Power supply ranges:
– 1.8 V to 5.5 V for VLCD
– 1.8 V to 5.5 V for VDD

• Ultra low-power consump

• 400 kHz I2C-bus interface (PCF8551A)

• 5 MHz SPI-bus interface (PCF8551B)

• Internally generated or externally supplied clock signal

CATALOG

PCF8551ATT/AJ COUNTRY OF ORIGIN

PCF8551ATT/AJ LIFECYCLE

PCF8551ATT/AJ PARAMETRIC INFO

PCF8551ATT/AJ PACKAGE INFO

PCF8551ATT/AJ MANUFACTURING INFO

PCF8551ATT/AJ PACKAGING INFO

PCF8551ATT/AJ ECAD MODELS

PCF8551ATT/AJ FUNCTIONAL BLOCK DIAGRAM

PCF8551ATT/AJ APPLICATIONS

COUNTRY OF ORIGIN

Thailand

LIFECYCLE

Obsolete
Aug 10,2021

PARAMETRIC INFO

Number of Segments	36
Minimum Operating Supply Voltage (V)	1.8
Typical Operating Supply Voltage (V)	3.3
Maximum Operating Supply Voltage (V)	5.5
Maximum Supply Current (mA)	2.7
Maximum Power Dissipation (mW)	100
Maximum Clock Frequency (MHz)	1024
Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	85
Interface Type	Serial
Operating Supply Voltage (V)	1.8 to 5.5
Display Type	Character
Maximum Storage Temperature (°C)	150
Minimum Storage Temperature (°C)	-55

PACKAGE INFO

Supplier Package	TSSOP
Basic Package Type	Lead-Frame SMT
Pin Count	48
Lead Shape	Gull-wing
PCB	48
Tab	N/R
Pin Pitch (mm)	0.5
Package Length (mm)	12.6(Max)
Package Width (mm)	6.2(Max)
Package Height (mm)	1.05(Max)
Package Diameter (mm)	N/R
Package Overall Length (mm)	12.6(Max)
Package Overall Width (mm)	8.3(Max)
Package Overall Height (mm)	1.2
Seated Plane Height (mm)	1.2
Mounting	Surface Mount
Package Material	Plastic
Package Description	Thin Shrink Small Outline Package
Package Family Name	SO
Jedec	MO-153

MANUFACTURING INFO

MSL	1
Maximum Reflow Temperature (°C)	260
Reflow Solder Time (Sec)	30
Number of Reflow Cycle	3
Reflow Temp. Source	Link to Datasheet
Maximum Wave Temperature (°C)	N/R
Wave Solder Time (Sec)	N/R
Lead Finish(Plating)	Au
Under Plating Material	Pd over Ni
Terminal Base Material	Cu Alloy

PACKAGING INFO

Packaging	Tape and Reel
Quantity Of Packaging	2000
Packaging Document	Link to Datasheet

ECAD MODELS

FUNCTIONAL BLOCK DIAGRAM

APPLICATIONS

• Metering equipment

• Consumer healthcare devices

• Battery operated devices

• Measuring equipment